US EPA

1632903 

Journal Article 

Marangoni wafer drying avoids disadvantages 

Wolke, K; Eitel, B; Schenkl, M; Rummelin, S; Schild, R 

1996 

0 

Solid State Technology
ISSN: 0038-111X 

39 

8 

87 

WOS:A1996VB24300023 

A major problem with wet-cleaning equipment in semiconductor wafer fabrication is the final step of the process - drying the wafers. Widely used drying techniques involve either spinning liquid off the wafer (which stresses the wafer) or using an isopropanol rinse and allowing it to evaporate (which may introduce safety and environmental problems). Marangoni technology provides a gentler, safer, and environmentally friendly alternative for wafer drying, compatible with both hydrophilic and hydrophobic wafer surfaces. This article explains the basic principle and process sequence for Marangoni drying, and demonstrates the technology's particle performance, residue-free drying, absence of wafer stress, and low alcohol consumption. Also, applications of the drying technique to 300-mm wafers and future cleaning technologies are discussed.