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1772226 
Journal Article 
Sputtering effects during plasma immersion ion implantation of metals 
Manova, D; Lutz, J; Maendl, S 
2010 
1 
Surface and Coatings Technology
ISSN: 0257-8972 
204 
18-19 
2875-2880 
WOS:000279378600005 
Changes in the surface topography during ion bombardment
are a ubiquitous effect, which is nevertheless sparsely understood, especially for
polycrystalline metals. Beside nucleation and grain growth processes, sputtering of individual
atoms is the dominant factor. Here, the development of the surface topography is investigated for
austenitic stainless steel and CoCr alloy using oxygen, nitrogen or argon ion bombardment. For a
better quantification with 3D optical profilometry, a time-of-flight secondary ion mass
spectrometry (ToF-SIMS) was used for the experiments. Beside an orientation dependent sputter
yield, inversely correlated with the positive secondary ion yield for the present fcc metals, an
increase in the nanoroughness with increasing fluence was observed, with the effect much more
pronounced for CoCr than for stainless steel. No significant influence of the ion species was
observed. In addition, an increased roughness is observed during PIII nitriding, depending on the
incident ion flux. Here, the combined roughness from nitriding and SIMS depth profiling leads to
a broadening of the nitrogen profile edge, which has to be corrected for. (C) 2010 Elsevier B.V.
All rights reserved. 
PIII; SIMS; Sputtering; Profilometry; Roughness