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HERO ID
2031496
Reference Type
Journal Article
Title
Structural studies of copper sulfide films: effect of ambient atmosphere
Author(s)
Kundu, M; Hasegawa, T; Terabe, K; Yamamoto, K; Aono, M
Year
2008
Is Peer Reviewed?
1
Journal
Science and Technology of Advanced Materials
ISSN:
1468-6996
EISSN:
1878-5514
Volume
9
Issue
3
Page Numbers
035011
Language
English
PMID
27878008
DOI
10.1088/1468-6996/9/3/035011
Web of Science Id
WOS:000263654000015
Abstract
We examined the structural properties of copper sulfide films as a function of the sulfurization time of 70-nm-thick Cu films. Copper sulfide films with various phases such as mixed metallic Cu-chalcocite, chalcocite, roxbyite, and covellite phases were formed with increasing sulfurization time. To evaluate the structural stability of various films, all the films were exposed to the ambient atmosphere for the same amount of time. Although the phase structure and stoichiometry of the films were maintained at a greater depth, the near-surface region of the films was oxidized and covered with overlayers of oxide, hydroxide, and/or sulfate species due to the exposure and reaction with the ambient atmosphere. The oxygen uptake and its reactivity with the copper sulfide film surfaces were enhanced with increasing sulfur content of the films. In addition, the type of divalent state of copper formed on the film surfaces depended on the phase structure, composition, and stoichiometry of the films.
Keywords
copper sulfide; x-ray photoelectron spectroscopy; x-ray diffraction
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