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2643013 
Journal Article 
Effect of Sintering Temperature on Silver-Copper Nanopaste as High Temperature Die Attach Material 
Tan, K; Cheong, K 
2013 
Yes 
Advanced Materials Research
ISSN: 1022-6680 
TRANS TECH PUBLICATIONS LTD 
STAFA-ZURICH 
Advanced Materials Research 
795 
47-50 
WOS:000339032300010 
A novel stencil-printable silver-copper (Ag-Cu) nanopaste that serves as an alternative high temperature die attach material was introduced in this study. The nanopaste was made by mixing 50 nm-sized of Ag and Cu particles with an organic binder system. Sintering temperatures, up to 450 degrees C, were used to sinter nanopaste in air and its post sintered properties were investigated. The viscosity of nanopaste was 350,000 cps and it demonstrated a shear thinning behavior. Scanning electron microscope revealed the change of grain structure with the change in the sintering temperature. Formations of Ag97Cu3 and Ag1Cu99 compounds after sintering were confirmed with X-ray diffraction; and the electrical conductivity of the sintered nanopaste was increased with the increase of the sintering temperature. The study concluded 380 degrees C was the optimum sintering temperature to form a well sintered nanopaste. 
silver; copper; sintering; die attach; high temperature applications; lead-free solder 
Zaki, RM; Pa, FC; Darus, M; 
978-3-03785-811-0 
2nd International Conference on Sustainable Materials (ICoSM 2013) 
Penang, MALAYSIA