Use of organosolv lignin in phenol-formaldehyde resins for particleboard production - II. Particleboard production and properties | Health & Environmental Research Online (HERO)

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HERO ID

2867562

Reference Type

Journal Article

Title

Use of organosolv lignin in phenol-formaldehyde resins for particleboard production - II. Particleboard production and properties

Author(s)

Cetin, NS; Ozmen, N

Year

2002

Is Peer Reviewed?

Yes

Journal

International Journal of Adhesion and Adhesives
ISSN: 0143-7496

Volume

Issue

Page Numbers

481-486

Web of Science Id

WOS:000179712000009

Keywords

adhesives for wood; composites; lap-shear; mechanical properties of adhesives