Health & Environmental Research Online (HERO)


Print Feedback Export to File
325785 
Book/Book Chapter 
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage 
Berthou, M; Retailleau, P; Fremont, H; Guedon-Gracia, A; Jephos-Davennel, C 
2009 
Elsevier, Oxford, 
49 
1267-1272 
This paper describes a reliable and reproducible method to reveal the microstructure of lead-free solder joints. This method is then used to follow the aging of lead free assembled chip resistors and BGA, with either ENIG or immersion Sn finishes. Two types of aging were applied: accelerated thermal cycles (ATC), and iso-thermal storage at three different temperatures. The associated failure mechanisms are compared and discussed. During ATC, microstructural changes under thermo-mechanical fatigue are evidenced, whereas thermal storage only induces intermetallic evolution, depending on the finish type. (English) 
Assemblage circuit intégré; Métal fondu brasage tendre; Défaillance; Technologie BGA; Résistance électrique; Vieillissement; Brasage sans plomb; Cycle thermique; Etude comparative; Assemblage brasage tendre; Microstructure; Integrated circuit bonding; Solder metal; Failures; BGA technology; Resistor; Ageing; Lead free soldering; Thermal cycle; Comparative study; Soldered joint; Metal fundido soldeo blando; Fallo; Tecnología BGA; Resistencia eléctrica(componente); Envejecimiento; Soldeo sin plomo; Ciclo térmico; Estudio comparativo; Junta soldada; Microestructura 
9-11