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338074 
Journal Article 
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints 
Yan, QI; Lam, R; Ghorbani, HR; Snugovsky, P; Spelt, JK 
2006 
1 
Microelectronics Reliability
ISSN: 0026-2714 
46 
2-4 
574-588 
Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. ATC testing decreases life cycle test time by one or more of the following means: increasing the heating and cooling rate, decreasing the hold time, or increasing the range of the applied temperature. The relative effect of each of these cycle parameters and the failure mechanisms they induce has been the subject of many studies; however uncertainty remains, particularly regarding the role of the heating and cooling rate. In this research, three conditions with two ramp rates (14 °C/min and 95 °C/min) and two temperature ranges (AT = 0-100 °C and -40 to 125 °C) were applied to resistor 2512 and PBGA 256 test vehicles assembled with SnPb and Pb-free solders. The test results showed that the higher ramp rate reduced the testing time while retaining the same failure modes, and that the damage per cycle increased with the temperature difference. For the resistors, the Pb-free solder joints lasted longer than the SnPb joints at the smaller AT, but were inferior at the larger AT. In contrast, the Pb-free solder joints in the PBGA test vehicles lasted longer than the SnPb solder under both conditions. (English) 
Packaging électronique; Durabilité; Assemblage circuit intégré; Métal fondu brasage tendre; Assemblage brasage tendre; Endommagement; Encapsulation plastique; Technologie BGA; Résistance électrique; Défaillance; Vitesse refroidissement; Temps exécution; Essai endurance; Cycle développement; Fiabilité; Brasage sans plomb; Cycle thermique; Effet température; Electronic packaging; Durability; Integrated circuit bonding; Solder metal; Soldered joint; Damaging; Plastic packaging; BGA technology; Resistor; Failures; Cooling rate; Execution time; Life test; Life cycle; Reliability; Lead free soldering; Thermal cycle; Temperature effect; Packaging electrónico; Durabilidad; Metal fundido soldeo blando; Junta soldada; Deterioración; Encapsulación plástica; Tecnología BGA; Resistencia eléctrica(componente); Fallo; Velocidad enfriamiento; Tiempo ejecución; Prueba duración; Ciclo desarrollo; Fiabilidad; Soldeo sin plomo; Ciclo térmico; Efecto temperatura