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4185953 
Journal Article 
Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte 
Liew, M; Ahmad, I; Lee, L; Nazeri, MFM; Haliman, H; Mohamad, AA 
2012 
1 
Metallurgical and Materials Transactions A
ISSN: 1073-5623
EISSN: 1543-1940 
SPRINGER 
NEW YORK 
43A 
10 
3742-3747 
WOS:000308187100035 
The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (E (corr)) and corrosion current density (i (corr)) obtained from the sample was -1.108 V vs Hg/HgO and 1.795 x 10(-4) A cm(-2), respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures. 
Hume-Rothery Symposium on Thermodynamics and Diffusion Coupling in Alloys-Application Driven Science 
San Diego, CA