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HERO ID
4666237
Reference Type
Journal Article
Title
Warpage Analysis on Thin Shell Part using Response Surface Methodology (RSM)
Author(s)
Zulhasif, Z; Shayfull, Z; Nasir, SM; Fathullah, M; Hazwan, MHM
Year
2017
Is Peer Reviewed?
Yes
Journal
AIP Conference Proceedings
ISSN:
0094-243X
EISSN:
1551-7616
Publisher
AMER INST PHYSICS
Location
MELVILLE
Book Title
AIP Conference Proceedings
Volume
1885
DOI
10.1063/1.5002313
Web of Science Id
WOS:000417379700119
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85030680181&doi=10.1063%2f1.5002313&partnerID=40&md5=4160039fb88237ee093051161beea61e
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Abstract
The optimisation of moulding parameters appropriate to reduce warpage defects produce using Autodesk Moldflow Insight (AMI) 2012 software The product is injected by using Acrylonitrile-Butadiene-Styrene (ABS) materials. This analysis has processing parameter that varies in melting temperature, mould temperature, packing pressure and packing time. Design of Experiments (DOE) has been integrated to obtain a polynomial model using Response Surface Methodology (RSM). The Glowworm Swarm Optimisation (GSO) method is used to predict a best combination parameters to minimise warpage defect in order to produce high quality parts.
Editor(s)
Saad, MNM; Ismail, RC; Ghazli, MF; Abdullah, MMA; Ramli, MM; AbdRahim, SZ; Isa, SSM;
Conference Name
3rd Electronic and Green Materials International Conference (EGM)
Conference Location
Aonang Krabi, THAILAND
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