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4721623 
Journal Article 
Effect of Postcure Conditions on the Dynamic Mechanical Behavior of Water-Based Polymer-Isocyanate Adhesive for Wood II. Investigation of a polyvinyl alcohol solution and polymeric diphenylmethane diisocyanate model 
Ling, Nan; Hori, N; Takemura, A 
2009 
55 
5 
293-298 
WOS:000272755500003 
In order to understand the effect of the heat treatment on the dynamic viscoelastic behavior of water based polymer-isocyanate adhesive for wood (API adhesive), we investigated the most simplified model of the adhesive between polyvinyl alcohol (PVOH) solution and polymeric diphenylmethane diisocyanate (pMDI) Fourier transform infrared spectroscopy (FT-IR) was performed for estimating the residual isocyanate groups (NCO) and isocyanate derivatives to elucidate the reaction mechanism under the heat treatment conditions The results are summarized as follows. (1) From DMA, a decrease of the storage modulus (E') appeared around 170 degrees C in the sample heated below 140 degrees C. When the treatment temperature exceeded 140 degrees C, the samples exhibited a rapid increase in E' in the high temperature region. with a correspondingly significant chemical structure change. These results correspond with those of API adhesive. (2) The different chemical products and tendency of E' of API adhesive as compared to the PVOH-pMDI model after 2 hours of heat treatment indicates that. the adding of styrene-butadiene copolymer latex NO may affect progress of reaction of residual isocyanate 
water based; isocyanate adhesive; heat treatment; dynamic mechanical analysis