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HERO ID
5347409
Reference Type
Journal Article
Title
Structure and thermal conductivity of powder injection molded AlN ceramic
Author(s)
Du, X; Qin, M; Sun, Yue; Yuan, Z; Yang, B; Qu, X
Year
2010
Is Peer Reviewed?
Yes
Journal
Advanced Powder Technology
ISSN:
0921-8831
EISSN:
1568-5527
Volume
21
Issue
4
Page Numbers
431-434
DOI
10.1016/j.apt.2010.01.001
Web of Science Id
WOS:000281123100011
Abstract
AlN powders doped with Y(2)O(3) (5 wt.%) were compacted by employing powder injection molding (PIM) technique. The binder consisted of paraffin wax (PW, 60 wt.%), polypropylene (PP, 35 wt.%) and stearic acid (SA, 5 wt.%). The feedstock was prepared with a solid loading of 62 vol.%. The binder was removed through debinding process in two steps, solvent debinding followed by thermal debinding. At last, the debound samples were sintered in flowing nitrogen gas at atmospheric pressure. The result reveals that thermal debinding atmosphere has significant effect on the thermal conductivity and structure of AlN ceramics. The thermal conductivity of injection molded AlN ceramics thermal debound in flowing nitrogen gas is 231 W m(-1) K(-1). (C) 2010 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.
Keywords
AlN ceramic; Powder injection molding; Thermal conductivity; Grain boundaries
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