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539658 
Journal Article 
Capillary wave formation on excited solder jet and fabrication of lead-free solder ball 
Zhang, SG; He, LJ; Zhu, XX; Zhang, SM; Shi, LK; Xu, J 
2005 
1 
Transactions of Nonferrous Metals Society of China
ISSN: 1003-6326 
15 
5 
997-1002 
English 
A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as lambda= C-vib (sigma/rho)(1/3) f(-2/3) to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball. 
jet; breakup; capillary wave; disturbance; solder ball