Application of environment-friendly ligands for alkaline electroless copper plating systems: A comparative study of electroless copper deposition using D-,L- and DL-tartrate as Cu(II) ligands | Health & Environmental Research Online (HERO)

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Citation
Tags

HERO ID

5943538

Reference Type

Journal Article

Title

Application of environment-friendly ligands for alkaline electroless copper plating systems: A comparative study of electroless copper deposition using D-,L- and DL-tartrate as Cu(II) ligands

Author(s)

Norkus, E; Kepeniene, V; Stalnioniene, I

Year

2012

Is Peer Reviewed?

Journal

Lietuvos Mokslu Akademija. Chemija
ISSN: 0235-7216

Volume

Issue

Page Numbers

155-170

Web of Science Id

WOS:000310349600003

Keywords

copper; tartaric acid; isomers; electroless copper deposition; surface roughness