US EPA

5963086 

Journal Article 

Adhesives and coatings from phenol-formaldehyde/resorcinol-formaldehyde resins 

Motawie, AM; Sadek, EM 

1998 

1 

Polymers for Advanced Technologies
ISSN: 1042-7147 

9 

12 

837-843 

English 

10.1002/(SICI)1099-1581(199812)9:12<837::AID-PAT842>3.0.CO;2-N 

WOS:000078032200003 

Resole phenol‐formaldehyde resins were prepared and modified with the prepared resorcinol‐formaldehyde resins. The optimum conditions of formulation and curing processes were studied to obtain modified wood adhesives characterized by high‐tensile shear strength values. This study indicated that the more suitable conditions are equal weight ratios of phenol‐formaldehyde to resorcinol‐formaldehyde resins in the presence of paraformaldehyde (10 or 15 wt%) of the resin content as a curing agent at 80 or 25°C for 40 min or 100–110 days, respectively. The activation energies of the curing reactions for phenol‐formaldehyde/resorcinol‐formaldehyde resin samples were determined. Metallic and glass coatings from the previous pure resins and their formulated cured mixtures were prepared and evaluated as varnishes or paints. 

adhesives; coatings; resole phenol-formaldehyde resin; resorcinol-formaldehyde resin; activation energy