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6608339 
Book/Book Chapter 
Impact modified high modulus PC/ABS blends: automotive and non-automotive applications 
Kulkarni, AS; Agarwal, P; Derudder, J; Van De Wetering, K; Ying, L; Zhang, J 
2009 
67th Annual Technical Conference of the Society of Plastics Engineers 2009 
2781-2786 
INSPEC:11251675 
The latest applications in automotive and computer & business equipment markets require a high modulus resin coupled with superior impact behavior. It is a challenge to deliver these new features in products, coupled with other desirable properties such as low thermal expansion and optimal melt-flow that enables filling of complex parts. This manuscript details the development of new PC/ABS blends based on novel filler technology to deliver these market needs.