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6672356 
Journal Article 
Glass Thinning by Fluoride Based Compounds Solution with Low Hydrofluoric acid Concentration 
Kim, JB; 김호태; 강동구 
2009 
20 
5 
557-560 
KJD:ART001384559 
In this study, a new wet etching method and the solution for thinning the glass with the thickness below 100 ㎛ were investigated. For the preparation of etching solution with low hydrofluoric acid, it was effective to use NH4F or NH4HF2 as a main ingredient with the addition of sulfuric acid or nitric acid. Influence of the composition of mixed acid solution and the temperature on the etching rate was investigated. The addition of anionic surfactant provides the function to prevent the adhesion of sludge generated by the etching reaction. A new wet etching pilot device equipped with streaming generation parts was used to test etching of commercial non-alkali glass and soda lime glass. The non-alkali glass with the thickness of 640 ㎛ and soda lime glass with the thickness of 500 ㎛ were etched to 45 ㎛ and 100 ㎛ , respectively, by using the pilot device. After the etching by pilot device, the roughness degree of the glass surface was maintained at 0.01∼0.02 ㎛ .