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7027471 
Journal Article 
Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes 
Tian, R; Hang, C; Tian, Y; Xu, J; , 
2019 
Yes 
Journal of Materials Processing Technology
ISSN: 0924-0136 
ELSEVIER SCIENCE SA 
LAUSANNE 
1-9 
WOS:000462691400001 
A continuous layer of Ni(3)Sn(4 )compounds was formed at the Sn-37Pb solder/Ni interface in ball grid array solder joints after reflowing. Au0.5Ni0.5Sn4 compounds were formed between Sn-37Pb solder and Ni3Sn4 layer during thermal shock between -196 degrees C and 150 degrees C, and the solder/Ni interface exhibited a duplex structure of Au0.5Ni0.5Sn4 and Ni3Sn4 layers only after 300 cycles. The growth of Ni3Sn4 and Au0.5Ni0.5Sn4 under thermal shock was significantly enhanced by high thermal stresses generated from the thermal expansion mismatch between Sn-37Pb solder and Ni, and the extreme temperature change (Delta T = 346 degrees C). The fast growth and high stiffness of Ni3Sn4 and Au0.5Ni0.5Sn4, as well as the thermal expansion mismatch between Ni3Sn4 and Au0.5Ni0.5Sn4, and the extreme temperature change resulted in the brittle fracture of Sn-37Pb solder joints at the Ni3Sn4/Au0.5Ni0.5Sn4 interface under extreme temperature changes.