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7027473 
Journal Article 
Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder 
Huang, ML; Zhou, Q; Zhao, N; Chen, LD; , 
2013 
Yes 
Journal of Materials Science: Materials in Electronics
ISSN: 0957-4522
EISSN: 1573-482X 
SPRINGER 
DORDRECHT 
2624-2629 
WOS:000321913000065 
The interfacial microstructure and mechanical properties of a low melting temperature lead-free solder of In-18.75Bi-22.15Sn (in at.%) (In-Bi-Sn) were investigated. The microstructure analysis of bulk In-Bi-Sn revealed that irregular lamellar gamma-Sn phases distributed in the In2Bi matrix. There was only a single endothermic peak with an onset temperature of 62 degrees C on the DSC curve, indicating that In-Bi-Sn is close to a ternary eutectic solder. The ultimate tensile strength of the bulk In-Bi-Sn was 21.76 MP at a strain rate of 10(-2) s(-1) at 25 degrees C. The elongation of the bulk In-Bi-Sn solder reached 87 %, indicating an excellent ductility of the In-Bi-Sn solder. Two intermetallic compounds (IMCs), needle-like Cu(In,Sn)(2) and laminar Cu-6(In,Sn)(5), formed at the In-Bi-Sn/Cu interface. An IMC layer of polyhedral crystallites of InNi formed at the In-Bi-Sn/Ni interface. The shear strength of Cu/In-Bi-Sn/Cu solder joints was 21.15 MP, and the shear fractograph showed that the ductile fracture with dimples appearance occurred in the solder.