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HERO ID
7175754
Reference Type
Journal Article
Title
Reliability behavior of lead-free solder joints in electronic components
Author(s)
Zhang, L; Han, JiG; He, Cwen; Guo, YH; ,
Year
2013
Is Peer Reviewed?
Yes
Journal
Journal of Materials Science: Materials in Electronics
ISSN:
0957-4522
EISSN:
1573-482X
Publisher
SPRINGER
Location
DORDRECHT
Page Numbers
172-190
DOI
10.1007/s10854-012-0720-y
Web of Science Id
WOS:000313799400026
Abstract
With more consumer products moving towards environmentally friendly packaging, making solder Pb-free has become an urgent task for electronics assemblies. Solder joints are responsible for both electrical and mechanical connections. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Materials behavior of solder joints involves a creep-fatigue interaction, making it a poor material for mechanical connections. The reliability of solder joints of electronics components has been found playing a more important role in service for microelectronics components and micro-electro-mechanical systems. So many researchers in the world investigated reliability of solder joints based on finite element simulation and experiments about the electronics devices, such as CR, QFP, QFN, PLCC, BGA, CSP, FCBGA and CCGA, which were reviewed systematically and extensively. Synchronously the investigation on reliability of solder joints was improved further with the high-speed development of lead-free electronic packaging, especially the constitutive equations and the fatigue life prediction equations. In this paper, the application and research status of constitutive equations and fatigue life prediction equations were reviewed, which provide theoretic guide for the reliability of lead-free solder joints.
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