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7203694 
Journal Article 
Recent Advances in Fault Isolation for Semiconductor Industry 
Chin, JMin; Qiu, Wen; Tan, J; Ranganathan, G; Oh, ZiY; Foo, FJie; Narang, V; Tay, MY; Phoa, SLay; Venkat, R; Ei, LH; Lim, SH; Teo, CWei; Zulkifli, S; , 
2013 
IEEE 
NEW YORK 
269-279 
WOS:000329045700050 
In semiconductor companies, failure analysis (FA) activities play a major role in all many areas. FA is deeply involved in new process technology development, 1st Silicon bring-up, wafer sort and backend yield improvement, product qualification and customer return analysis.Regardless of area that FA supports, there is always a need for fault isolation prior to the physical or destructive failure analysis. Fault isolation is the step where we narrow down the area of a failing part or product to a manageable area. This allows FA engineer to improve the success of physically finding root cause of the failure and speeds up the Turn-around time for the analysis.This invited talk will cover recent advances in fault isolation techniques and tools in device/silicon and packaging Case studies for those techniques will be covered to provide greater understanding for the techniques to the audience. 
Wang, M; Jiang, Y; Zhao, C; Huang, W; Song, X; 
978-1-4799-1241-4 
20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 
Suzhou, PEOPLES R CHINA