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7227379 
Journal Article 
A review on epoxy-based electrically conductive adhesives 
Aradhana, R; Mohanty, S; Nayak, SK; , 
2020 
Yes 
International Journal of Adhesion and Adhesives
ISSN: 0143-7496 
ELSEVIER SCI LTD 
OXFORD 
WOS:000528557500026 
Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented.