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HERO ID
7239621
Reference Type
Journal Article
Title
Effect of Ag on the properties of solders and brazing filler metals
Author(s)
Wang, He; Xue, Sbai; ,
Year
2016
Is Peer Reviewed?
Yes
Journal
Journal of Materials Science: Materials in Electronics
ISSN:
0957-4522
EISSN:
1573-482X
Publisher
SPRINGER
Location
DORDRECHT
Page Numbers
1-13
DOI
10.1007/s10854-015-3747-z
Web of Science Id
WOS:000368054600001
Abstract
Ag is used as a beneficial alloy element in no matter solders or brazing filler metals. Obviously, the addition of Ag has a positive function on melting temperature, wettability, mechanical property and conductivity of filler metals. Therefore, Ag is still widely used in many researches and production in spite of that Ag is very expensive. Respectively, three kind of typical solders (Sn-Ag-Cu, Sn-Zn and Sn-Bi) and brazing filler metals (Ag-Cu-Zn, Cu-P, and Zn-Al) have been chosen for illustration. This article summarizes research status on the studying of Ag-contained solders and brazing filler metals, also analyses influence rules of Ag addition on the change of filler metals' physical property, microstructure as well as mechanical property. Moreover, the problems and difficulties in the process of study Ag-contained solders and brazing filler metals have been presented. Synchronously, some suggestions have been put forward which may solve the problems and difficulties mentioned above, which provides theory guide for the follow-up study of Ag-contained solders and brazing filler metals, and their prospects are also looked ahead.
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