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HERO ID
7301601
Reference Type
Journal Article
Title
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
Author(s)
Chao, SC; Huang, WeiC; Liu, JenH; Song, JM; Shen, PoYen; Huang, ChiLin; Hung, LT; Chang, CH
Year
2019
Is Peer Reviewed?
1
Journal
Microelectronics Reliability
ISSN:
0026-2714
Volume
99
Page Numbers
161-167
DOI
10.1016/j.microrel.2019.05.020
Web of Science Id
WOS:000496833600018
Keywords
Surface oxide; Coulometric reduction; FTIR; Lead frame; Adhesion
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