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7301601 
Journal Article 
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds 
Chao, SC; Huang, WeiC; Liu, JenH; Song, JM; Shen, PoYen; Huang, ChiLin; Hung, LT; Chang, CH 
2019 
Microelectronics Reliability
ISSN: 0026-2714 
99 
161-167 
Surface oxide; Coulometric reduction; FTIR; Lead frame; Adhesion