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HERO ID
7304932
Reference Type
Journal Article
Title
Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)
Author(s)
Kim, SunC; Kim, YHo
Year
2013
Is Peer Reviewed?
Yes
Journal
Current Applied Physics
ISSN:
1567-1739
Publisher
Elsevier
Volume
13
Issue
Elsevier
Page Numbers
S14-S25
DOI
10.1016/j.cap.2013.05.009
Web of Science Id
WOS:000323140300003
URL
https://linkinghub.elsevier.com/retrieve/pii/S1567173913002010
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Keywords
Flip chip bonding; Anisotropic conductive film; Nonconductive adhesive
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