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8167841 
Journal Article 
The mechanism of the electrode process between copper amalgam and copper glycollate solutions 
Fronus, S; Johansson, CL 
1973 
1 
Journal of Electroanalytical Chemistry and Interfacial Electrochemistry
ISSN: 0022-0728 
48 
2 
195-205 
English 
The electrode reaction at copper amalgam in complex copper glycollate solutions has been studied by impedance measurements at the equilibrium electrode potential. As supporting electrolyte 1 M sodium perchlorate has been used. Evidence is given that the overall electrode reaction proceeds stepwise with the charge transfer between Cu(I) and Cu(II) via the amalgam as rate-limiting at low glycollate ion concentrations. With increasing concentrations the rate of this step increases considerably, so that the charge transfer between the amalgam and Cu(I) becomes the slowest step. The rate-enhancing effect of the glycollate ion is explained in terms of complex formation and ligand bridging at the electrode by the carboxylate group. © 1973 Elsevier Sequoia S.A.