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8354481 
Journal Article 
Experimental Study of Chip Offset on the Packaging Consistency of High Power Light-Emitting Diodes 
Xie, Bin; Chen, Qi; Yu, X; Shang, B; Huang, M; Luo, X; , 
2015 
IEEE 
NEW YORK 
WOS:000380377000233 
In this study, we experimentally investigated the effect of chip offset on the packaging consistency of high power LED. A series of LED modules with different chip offset distances and phosphor mass concentration were packaged, and two comparative experiments were conducted. Compared with the conventional modules, the maximum CCT deviation of off-centered modules increased from 128K to 667K. The results show that chip offset contributes significantly to the consistency of LED packaging. 
Bi, KY; Zhu, WH; He, H; 
16 int conf elect packaging technology 
Changsha, PEOPLES R CHINA