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1586726 
Journal Article 
Copper underpotential deposition on TiO2 electrodes: A voltammetric and electrochemical quartz crystal nanobalance study 
Rosario, AV; Santos, MC; Mascaro, LH; Bulhoes, LOS; Pereira, EC 
2010 
1 
Thin Solid Films
ISSN: 0040-6090
EISSN: 1879-2731 
518 
10 
2669-2673 
WOS:000275920000016 
In this work, the electrogravimetric behavior of copper
electrodeposition on TiO2 electrodes was analyzed. Copper electrodeposition was carried out in
0.1 mol L-1 H2SO4 using several concentrations of CuSO4. The voltammetric curve displays a redox
processes. The first redox process occurs in the region of -0.30 at 0.1 V (vs. saturated calomel
electrode, SCE) and it is related to bulk Cu electrodeposition and stripping. For this cathodic
process, it was observed that the mass gain increases both as the sweep rate decreases and as the
concentration of copper increases. The second redox process, which occurs between -0.1 V and 0.35
V (vs. SCE), the stripping charge (and mass) are independent of both sweep rate and CuSO4
concentration and, finally, there is a saturation charge (and saturation mass) as the deposition
time is increased. From the saturated mass, obtained using an electrochemical quartz crystal
nanobalance, for this electrodeposition process (248 ng cm(-2)) a roughness factor of 1.8 was
calculated for the TiO2 film. (C) 2009 Elsevier B.V. All rights reserved. 
Titanium dioxide; Copper Underpotential electrodeposition; Polymeric precursors 
• Inorganic Mercury Salts (2)
     Mercurous Chloride
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