US EPA

4957014 

Journal Article 

QUENCHING STRESS IN PLASMA-SPRAYED COATINGS AND ITS CORRELATION WITH THE DEPOSIT MICROSTRUCTURE 

Kuroda, S; Dendo, T; Kitahara, S 

1995 

1 

Journal of Thermal Spray Technology
ISSN: 1059-9630
EISSN: 1544-1016 

4 

1 

75-84 

10.1007/BF02648531 

WOS:A1995RB44200009 

Quenching stress arises within a thermally sprayed splat as its thermal contraction after solidification is constrained by the underlying solid. Dependence of the quenching stress in plasma-sprayed deposits of Ni-20Cr alloy and alumina on the substrate temperature during spraying was discussed in conjunction with the change in the nature of the interlamellar contact between splats, It was found by mercury intrusion porosimetry and observation of cross sections of impregnated deposits that the interlamellar contact is improved significantly by raising the substrate temperature during deposition from 200 to 600 degrees C. The positive dependence of the quenching stress on the substrate temperature in this temperature range was attributed to a stronger constraint against thermal contraction of sprayed splats after solidification due to the improved contact. 

RESIDUAL STRESS; POROSITY; INTERLAMELLA CONTACT; SUBSTRATE TEMPERATURE; RAPID SOLIDIFICATION