US EPA

6956699 

Journal Article 

Review of Power Electronics Components at Cryogenic Temperatures 

Gui, H; Chen, R; Niu, J; Zhang, Z; Tolbert, LM; Wang, FF; Blalock, BJ; Costinett, D; Choi, BB; , 

2020 

Yes 

I E E E Transactions on Power Electronics
ISSN: 0885-8993 

English 

32499667 

10.1109/tpel.2019.2944781 

In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics systems. This paper reviews the influence of cryogenic temperature on power semiconductor devices including Si and wide bandgap switches, integrated circuits, passive components, interconnection and dielectric materials, and some typical cryogenic converter systems. Also, the basic theories and principles are given to explain the trends for different aspects of cryogenically cooled converters. Based on the review, Si active power devices, bulk CMOS based integrated circuits, nanocrystalline and amorphous magnetic cores, NP0 ceramic and film capacitors, thin/metal film and wirewound resistors are the components suitable for cryogenic operation. Pb-rich PbSn solder or In solder, classic PCB material, most insulation papers and epoxy encapsulant are good interconnection and dielectric parts for cryogenic temperatures.