US EPA

1372095 

Journal Article 

Safety and Environmental Control Systems Used in Chemical Vapor Deposition (CVD) Reactors at AT and T-Microelectronics Reading 

Rhoades, BJ; Sands, DG; Mattera VD Jr 

1989 

Yes 

Applied Industrial Hygiene
ISSN: 0882-8032 

NIOSH/00187822 

4 

5 

105-109 

Special safety considerations were necessary during the production of photonic materials by chemical vapor deposition (CVD) methods using arsenic-trichloride (7784341) and phosphorus-trichloride (7719122). Sophisticated safety and environmental control systems used with CVD reactors at the AT and T Microelectronics Facility in Reading, Pennsylvania were described. An exhaust system was designed to prevent the exposure of any persons to the toxic source chemicals used in the reactor. A vent scrubbing system trapped arsenic contaminated reaction products before they reached the outside environment. In order not to have to rely on a software based system, the control of the reactor passed to safety control logic from the resident microprocessor during maintenance and emergency conditions to ensure that safe operating conditions continued. The overall reactor layout was described with emphasis placed on each of its five sections: the bubbler loading zone, the substrate loading zone, the gas inject area, the vent treatment area, and the furnace area, each of which is located in separate partitions. Descriptions were given of the bubbler loading precautions, treatment of arsenic contaminated spills, reactor control, and air pollution control devices. The authors note that based on experience gained at this location, CVD reactors should have dedicated gas delivery and vent piping. This piping should be nonflammable and leak tight. Safety logic systems should operate independently of the computers that are typically used to control reactors during normal processing. 

DCN-183271; Control technology; Semiconductors; Arsenic compounds; Phosphorus compounds; Safety engineering; Computers; Electronics industry