Reliability of low-cost PCB interconnections for telecommunication applications | Health & Environmental Research Online (HERO)

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Citation
Tags

HERO ID

2160414

Reference Type

Journal Article

Title

Reliability of low-cost PCB interconnections for telecommunication applications

Author(s)

Duchamp, G; Verdier, F; Deshayes, Y; Marc, F; Ousten, Y; Danto, Y

Year

2004

Is Peer Reviewed?

Journal

Microelectronics Reliability
ISSN: 0026-2714

Volume

Issue

9-11

Page Numbers

1299-1304

DOI

10.1016/j.microrel.2004.07.013

Web of Science Id

WOS:000224280000005

Abstract

Today the low cost PCB interconnections are widely used for domestic telecommunication applications. These technologies are limited by the possible variation of the performances of substrates and metallization during operating life. The knowledge of the behaviour of these parameters under stress conditions allows to optimise the design safety margins and to predict a probable lifetime. In this paper we show that the proposed structures (rings and stub resonators) could be used to discriminate the degradation sources. (C) 2004 Elsevier Ltd. All rights reserved.