US EPA

2167813 

Book/Book Chapter 

Demonstration of on-PCB optical interconnection using surface-mount package and polymer waveguide 

Ishii, Y; Hayashi, T; Takahara, H; IEEE; IEEE 

2003 

ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 

1147-1152 

WOS:000183448100188 

An on-PCB optical interconnection using surface-mountable optoelectronic packages and a polymer waveguide is described. A new packaging concept called "OptoBump", which is a short-distance free-space optical coupling between the optoelectronic package and the PCB, provides full compatibility with surface-mount technology. First, two prototype packages that contain a VCSEL/PD array chip inside the cavity of an interposer were developed. Both operated normally. Next, a polymer waveguide with 45degrees mirrors was found to achieve a loss as low as 4 dB/m. Finally, 1.25 Gbit/s x 3-channel parallel optical interconnections over a 30-mm-long waveguide on the PCB were successfully demonstrated. This demonstration clearly exhibits the great potential to provide low-cost, high-performance optical interconnections on a PCB.