US EPA

2171478 

Journal Article 

SURFACE MOUNT TECHNOLOGY (SMT) - INTERNATIONAL PERSPECTIVE AND AN ACTION PLAN FOR INDIA 

Kumar, K; Sarnot, SL 

1992 

19 

7 

335-382 

WOS:A1992HR04400001 

Surface Mount Technology (SMT) has revolutionised the assembly technology. It has resulted in miniaturisation of electronic products with more functions at lower cost. The application of this technology has also led to the development and production or whole range of portable equipment such as LCD TV, VCR cum camera, portable telephone, facsimile, photo copying, personnel and lap top computers and a variety of other equipment. The introduction of newer packaging technologies e.g. - Tape automated bonding (TAB) of LSI and VLSI chips, Multichip Modules (MCMs) has led to enormous advantages in increasing packaging densities. It is estimated that more than 40 per cent of total electronic assemblies in Europe, Japan and USA are based on surface mount technologies. Japan leads in application of this technology in many consumer products whereas USA dominates in professional sector like telecommunication, computers and defence electronics.



The designer of electronic assemblies using SMT needs thorough knowledge of electronic components (SMDs) and their supply formats, placement equipment, materials, processes, soldering systems besides circuit design and layout. The failure mode of SMT based circuit boards are also quite different when compared with conventional designs. The high density of these boards also poses new problem in testing and repairs. The cost of infrastructure for surface mount technology is many fold higher and hence require, special SMT centres to cater for small users.



The present report provide a comprehensive survey of all aspects of surface mount technology. It includes details of process materials (adhesive and solder cream/pastes), process technologies, surface mount components and supply formats, PCB design, mounting and soldering systems, testing and repair of assembled boards etc. A brief or TAB and MCM packaging technologies has also been included. A perspective for Indian Electronic industry has been presented keeping in view the existing infrastructure as well as gap areas. Contract manufacturing activities and SMT Training centre have been proposed to popularise and to provide assembly facilities for large number of small users.