US EPA

2173139 

Journal Article 

Analysis on Thermal Reliability of Key Electronic Components on PCB 

Li, X; Xu, S 

2012 

15 

12B 

5719-5724 

WOS:000313149000023 

Electronic equipments develop continuously toward light, thin, small miniaturization trend. With the increased integration of electronic components and high heat density, small size, compact layout, it leads to high temperature of electronic components which greatly reduce the service life of components and cause job insecurity, failure of components and poor system reliability. Therefore, the thermal design becomes increasingly important. In this paper, the cooling of print circuit board (PCB) as well as several major electronic components is studied as the research object with their thermal reliability based upon heat transfer and fluid dynamics. The layout optimization problem of components on PCB is studied. The corresponding FEM model is established so that the temperature field of the main cooling electronic components on the PCB is solved through the analysis software-ANSYS which displays the high temperature and low temperature areas of PCB. Through realizing the layout optimization of the main cooling electronic components on the PCB and calculating temperature field of the PCB for different layout examples, the rational layout is obtained by comparing the results. This method does not change the condition of external cooling but reduce the maximum working temperature of PCB, improve the reliability of the system and provide a reference for thermal reliability designing of electronic products. 

Print circuit board; Temperature field; FEM; Optimal design; Reliability