US EPA

2189575 

Journal Article 

Embedded passives technology for PCBs: Materials, design, and process 

Zhou, JM; Myers, JD; Felten, JJ; IMAPS; IMAPS 

2002 

Unk 

Proceedings of SPIE
ISSN: 0277-786X
EISSN: 1996-756X 

PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) 

4931 

577-582 

WOS:000179072400100 

Embedded capacitors and resistors have great potential for high frequency, high density, and low cost applications. This paper summarizes Delphi Delco Electronics Systems' current activities of material evaluations and emulator design for the Advanced Embedded Passives Technology (AEPT) project. DuPont ceramic resistive and 3M C-Ply capacitive materials are chosen for an engine controller technology evaluation vehicle. Thermal cycling (40 to 125 degreesC, 1h/cycle, 1000 cycles) and electrostatic discharge (ESD, +/-2, +/-4, +/-6, and +/-8kV) tests were conducted on these resistive and capacitive materials respectively. For the first time, using these advanced materials and a self-enhanced CAD tool, 94% (205 out of 217) of the resistors and 12% of the capacitors of the controller are buried into the organic laminate boards. The embedded 205 resistors are trimmable and can be trimmed with an accuracy of +/-2%. It is believed that thermally and electrically stable resistive material with broad resistance values (e. g. 10 Omegasq. to 100 KOmegasq.), capacitive material with high capacitance density (e.g. 200 nF/in(2)), sophisticated CAD tools, and a mature cost modeling are the key factors in moving embedded passives from a niche market to a broad base of applications. 

embedded resistors; embedded capacitors; material properties; and evaluation vehicle design